Established in 2021, Kiwimoore is a pioneering company in China specializing in 2.5D and 3DIC Chiplet technology. The company focuses on advanced computing architecture and offers a comprehensive portfolio of 2.5D and 3DIC Chiplet products and turnkey services for heterogeneous integration. Kiwimoore's products are designed to meet the demands of high-performance applications, making them ideal for cutting-edge markets such as next-generation data centers, autonomous vehicles, and personal computing. The company's solutions are characterized by high bandwidth and low power latency, improving chip performance while reducing research and development costs and cycles. Kiwimoore's offerings include the Kiwi NDSA G2G High-Speed IO Die and Kiwi Topup, which enhance data center CPUs, GPUs, AI, and autonomous vehicles. The company also provides advanced 3DIC packaging solutions, including substrates, RDL, and SI interposers, and integrates high-speed interfaces such as Die2Die, PCIe, and DDR through an internetwork on Chiplet.

Keywords: 2.5D Chiplet, 3DIC Chiplet, high-performance computing, data centers, autonomous vehicles, personal computing, high bandwidth, low power latency, advanced packaging, heterogeneous integration.